Date:  Wednesday, May 28, 2014
Time:  6:00 P.M.
Location:  AERO Institute
38256 Sierra Hwy
Palmdale, CA 93550

Catered Dinner
$15.00 Per Person - Dinner is free if you RSVP by 5/21/2014
Every dinner includes; meat dish, vegetarian casserole, dessert, coffee, tea water and soda.

SPEAKER:  Glenn Oliver, Senior Engineer, Dupont Electronics & Communications - Circuit Packing Materials
Glenn Oliver is a Senior Engineer responsible for materials characterization and applications development in high speed and high frequency applications for DuPont Electronics & Communications. He has been with DuPont since 2003. Glenn also currently chairs the IPC-D24C Task Group responsible for developing frequency domain test methods for permittivity and loss tangent. Prior to DuPont, he worked 8 years in the laser and photonics industry in roles including sales, product development, process engineering, and college instructor. 
 
Presentation: Kapton® and Pyralux® Solutions
Most people are familiar with polyimide, which was originally invented by DuPont who markets this material under the brand name Kapton®. However, many people do not understand that there are dozens of formulations of this material that are tailored to meet the demands of different applications. For instance, one type of polyimide was developed to be flexible yet strong enough to make electronic circuits. This polyimide is used to make Pyralux® printed circuit materials. We will discuss some of the Kapton® types that help solve challenges in military and aerospace with a special emphasis on flexible circuits.